2027.10.27-29
Shenzhen World Exhibition & Convention Center

Grand Opening! Day One Highlights of AWC 2026 — Automotive Electronics & Intelligent Connected Vehicle Innovation on Full Display!

On the first day, the show floor is at full heat! AWC 2026, the Shenzhen International Intelligent Connected Vehicle Industry Exhibition, brings together leading companies from China and overseas across automotive electronics manufacturing, intelligent connected vehicles, core components, testing & measurement, and supply-chain support. On the floor, the automotive electronics manufacturing demonstration line, the automotive electronics display zone and several professional forums run concurrently, showcasing new technologies, equipment and solutions amid the electrification, intelligence and connectivity of the automotive industry.

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Automotive Electronics Manufacturing Demonstration Line

Yuzhou Electronics, Tianji Intelligent, Helixin, Langguang Precision, Liyade, Yingshang and Dezheng and other automotive electronics manufacturers present core technologies and deployed results, covering four key segments: SMT/DIP mounting processes, semiconductor packaging and testing, high-voltage harness processing and product reliability testing. Booths are constantly busy, and automotive electronics remains a hot draw.

 

Meanwhile, the Automotive-Grade Electronics Smart Manufacturing & Precision Process Innovation Seminar was equally lively. It gathered well-known companies and institutions including Cognex, TUV Rheinland, Hikrobot, Hollysys, JAKA Robotics and Mech-Mind, whose speakers addressed AI machine vision, full-chain automotive smart manufacturing solutions, AEC-Q reliability testing and failure analysis, quality traceability systems, flexible production, ESD protection and automotive display materials. Together they connect the full chain from design and manufacturing to test and validation, helping electronics manufacturers seize new opportunities in the automotive smart-manufacturing upgrade.

Automotive Electronics Display Zone

Automotive electronics remains a powerful growth engine for electronics manufacturing. This edition brings together quality companies such as Pengchuangda, Youen, Wokenda, Keming, Kewen, Zhongjixin, Dejiabao and Shizai Intelligent, spanning semiconductor components, automotive parts, reliability testing equipment and smart manufacturing technology. They connect the core links of the automotive electronics upstream supply chain, drawing crowds of industry professionals and a steady flow of business opportunities.

A Star-Studded Line-up Gathers in Shenzhen: Top Exhibitors Assemble Under One Roof

Leading assembly brands — ASMPT, Fuji, Panasonic, Yamaha, Hanwha, Omron, TRI, Gaoying, Kurtz, Rehm, Nordson, Zhuxin, JT Automation, GKG, SUN EAST and Quick — appear at NEPCON ASIA 2026, covering key electronics process steps. New SMT equipment and solutions for surface mounting and printing, soldering, dispensing, coating, testing and measurement, and peripheral equipment are showcased side by side.

Among the highlights, ASMPT gives the Asian premiere of its SIPLACE V platform, anticipating future requirements and fully empowering production-line automation upgrades with leading performance, extreme flexibility and ultra-high accuracy. YAMAHA brings the YRH10W mounter to China for the first time, simplifying line changeovers and using smart production assistance to sharply cut on-site working time for anytime, zero-threshold component replenishment. FUJI unveils the AIMEXR extended multi-function integrated mounter, featuring a newly developed R head that widens the range of component and board sizes it can handle. First-time exhibits also include the AC3000 in-line board programming automation system, the AS510 in-line large selective wave soldering system, the Aurora vacuum furnace and JUKI's RS2 high-speed intelligent modular mounter — all supporting high-quality, long-term growth across every area of electronics manufacturing.

New products lift the industry to new heights, and a wave of first-time exhibitors adds fresh energy! This edition welcomes more than 100 new exhibitors, with brands such as Langshi, Peters, Mitsubishi, SETECH, Shifang, Yingzhi, Konecranes and Yudian exhibiting for the first time. They present the 2043MK-SCVR high-speed vacuum furnace, conformal coating, the RP system, the SQV series smart screwdriving machines, high-precision functional coating print engines, low-headroom hoists and high-precision multi-channel smart temperature controllers, giving a fuller picture of innovation and cutting-edge applications in electronics manufacturing equipment and technology.

More Highlights in Full Force: Precise Coverage Across Multiple Sectors

Innovation everywhere, highlights at every turn! Automotive electronics, optical modules, computing power and electronic smart assembly together present full-industry-chain resources, from core equipment and key components to complete-line solutions. Exhibitors are racing to showcase new results in today's hottest application areas, drawing visitors from far and wide and pushing industry interest to new highs.

 

Electronic Smart Assembly Theme Zone

Hongzhan, Ruichi, Jieteda, SETECH, Fugong Yunzhi, Wanpengda and Senyang appear in the S-FACTORY Electronic Smart Assembly Theme Zone, presenting complete-chain solutions from basic hand assembly tools to intelligent automated assembly systems. They drew wide attention from visitors in consumer electronics, automotive electronics, medical electronics, industrial control electronics and new-energy electronics, who experienced firsthand the technology upgrade and process integration taking place in electronics assembly.

Optical Module Manufacturing Process Demonstration Zone

FUJI mounters, Luichen AOI, Zhuxin bonders and Ruichichuangtong buffer furnaces — core equipment widely used on high-volume optical module lines — are on display together, covering the three key processes of COB packaging, module assembly and test/burn-in. Companies from every sector flocked in for a look at new fields and new business opportunities.

 

Running alongside was the Advanced Optical Communication Manufacturing Technology Innovation Summit — “Breaking Through Volume Production: From Process to Capacity.” The forum drew a packed, enthusiastic audience and brought together authorities from industry and academia, including the School of Integrated Circuits at Shenzhen Polytechnic University, FiberHome, Woge Group, Lizhu Intelligent Equipment and Anhui Lingguang Infrared. They shared in-depth views on NPO optical engine technology, optoelectronic heterogeneous packaging equipment innovation, 3.2T optical module AI plus digital-twin smart manufacturing and glass substrate applications, offering front-line insight and practical paths for ramping up optical module production.

Computing Power & Liquid Cooling Zone

The Computing Power & Liquid Cooling Zone is packed with visitors! Aojie AOC Technology, Shengyang Electric, Aite, Fushixi, Tianxing Measurement and Jiechuang Measurement & Control and other companies bring the full computing power chain — intelligent computing centers, AI chips, optical modules, complete servers, large-scale storage, high-speed network interconnect, and computing services and leasing — creating a rare dedicated event for deep “computing power + industrial scenarios” matching.

 

A hot start and a packed house! The 2026 Smart Computing Ecosystem Conference — Computing Center Infrastructure & AI Applications Forum — featured Sugon, Inspur, China Mobile, China Unicom, Vertiv, Midea, Ruisibo Chuang, Tianjin Ti'er, SenseTime, Yakang Wanwei and FiberHome alongside many other industry leaders and experts. They analyzed current policy trends, demand implementation, infrastructure support and scenario innovation, giving leaders and peers across the AI computing chain new industry insights and new business opportunities.

Automation + Electronics Manufacturing: Raising Capacity Utilization

Elite Robots, HIWIN, Flexiv, IKO, Youngsun Intelligent, Quanchuan Technology, Konecranes, Global Group and MEAN WELL and many other companies are presenting five core segments — industrial robots, smart warehousing, motion control, industrial software and packaging equipment. Crowds are gathering and conversations flowing at every booth.

Held alongside, the Industrial Components Empowering Smart Equipment Innovation Conference and the Smart Factory & AI Automation Integration Forum brought a rolling line-up of automation industry leaders and experts from Xinbu Technology, Gaochuan, Baigu Intelligent, Shenzhen Industrial 4.0 Promotion Association, Yancheng National High-tech Zone, Elite Robots, Flexiv and Lvshengshi, offering a one-stop panorama of the smart manufacturing upgrade, from core components to smart factories.

Embodied Intelligence Terminal Applications: Opening New Horizons for Cross-Sector Collaboration

Unitree, DeepRobotics, UBTECH, Leju Robotics, Rokae, Shenhao Technology, Booster Robotics, Amiao Robotics, Shenzhen Ruoyu Technology, Lebo Space, Jingdong Zhixin, Qingtianzu, NSK, Lingxin Qiaoshou, Haoling Robotics, Yaoxing Technology, Huaxun Robotics, Laifu Harmonic and Zhongke Lingxi — a broad roster of robotics companies — present full-chain products including industrial, commercial-service and special-purpose robots, secondary development, leasing platforms, core components, new materials and volume-production support, showing how embodied intelligence is taking shape in real manufacturing scenarios.

 

On-site forums centered on four core themes — technology innovation and supply-chain collaboration, industrial smart-manufacturing upgrades, commercial service deployment and special extreme operations — drew a full house and lively audience interaction. UBTECH, SF Group, NSK, Booster Robotics, Qiteng Robotics, Shenhao Technology, CVC Testing, LexisNexis and Lianhe Imaging and other well-known companies and institutions shared their experience, exploring new paths for scaled deployment of embodied intelligence, from core technology and key components to real-world scenarios.

A Full House: Sparking New Ideas for Electronics Manufacturing

Multiple professional forums delivered in-depth analysis, industry trends and reusable real-world case studies on core hot topics — smart manufacturing, 6G communications, reliability, optical communications, intelligent computing applications, automotive electronics, smart factories, AI automation, warehousing and logistics, embodied-intelligence robots and machine vision — providing electronics manufacturers with a high-quality, academically strong and practice-focused platform for exchange.

Among them, the SMTA South China High-Tech Technology Symposium and the SMTA South China High-Tech Equipment Symposium were held on the same day, focusing on process upgrades such as the latest in advanced packaging and soldering materials, chip programming, AI 3D X-Ray defect inspection, closed-loop cleaning and smart logistics for automotive electronics. Experts from Indium Corporation, MKS Atotech, AIM Solder, ZTE, United Automotive Electronic Systems, Anke Technology, Puruiyuan Intelligent, Sanjie Machinery and Shanmu Electronics shared hands-on solutions, blending hard content with interaction in a technical feast for South China's electronics manufacturing industry.

Facing the high-reliability challenges that the 6G era and smart terminal upgrades pose to SMT processes, the Communications & Smart Terminals High-Reliability SMT Efficient Process & Technology Innovation Forum brought heavyweight industry and academic speakers onto one stage, including CCID Consulting, China CEPREI Laboratory, ZTE and CRRC Zhuzhou. They shared insights on how the SMT industry can break through and renew itself in the 6G era, end-to-end control of tin-whisker risk in COTS components, board-level interconnect failure analysis, high-temperature service strategies for power chips and multi-material compatibility of automotive PCBA — a technical feast spanning trend analysis to process implementation for high-reliability electronics manufacturing. Alongside it, the soldering skills competition and the harness and cable assembly process and operation skills contests offered hands-on showdowns that drew crowds of electronics manufacturing engineers and technicians eager to watch, learn and exchange ideas.

Over 200 Domestic and Overseas Delegations Discuss the New Future of Manufacturing

Old friends and new gather at the show! More than 200 domestic and overseas delegations attended, with purchasing groups and industry delegations from home and abroad meeting in one place to connect with cutting-edge technology and market resources. This accelerates technology collaboration and innovation among exhibitors as well as business talks, and keeps energizing industry exchange.

 

Beyond the exhibition halls, the show also organized a visit to Flexiv's South China Smart Manufacturing Base, taking overseas visitors onto a real production line for a close-up view of the complete embodied-intelligence robot manufacturing process, from components to finished machines, and a sense of how automation technology actually runs.