Date

Time

Topics（Proposed）

Speakers（Proposed）

Oct 27

（Morning）

10：30-10：40

Welcome Address

Hosted by: Zaoche

10：40-11：00

Automotive-Grade Electronics Reliability Testing Standards (AEC-Q) and Failure Analysis & Traceability

TÜV Rheinland

11：05-11：25

Industrialization of New Soldering & Dispensing Processes and Materials for Automotive Electronics

Organizer

11：30-11：50

Process Optimization and Defect Prevention & Control for Automotive-Grade Precision Soldering

Magic-ray

11：50-12：10

Intelligent Dispensing Process Upgrade and High-Precision Control Technologies for Automotive Electronics

TBA

12：10-13：30

Lunch & Exhibition Visit

Oct 27

（Afternoon）

13：30-13：50

Manufacturing Process Compliance and Risk Control for Automotive-Grade Electronics Targeting ASIL-D

TBA

13：55-14：15

Packaging Material Iteration and Standardization System Development for Automotive Electronics

Organizer

14：20-14：40

Innovation in High-Density, High-Reliability Automotive-Grade Electronic Packaging Processes

Organizer

14：45-15：05

Flexible Automated Production and Digital Factory Upgrade for Automotive Electronics

JAKA Robotics

15：10-15：30

Automated Quality Control and Traceability System Development for Smart Manufacturing of Automotive Electronics

SIC Marking

15：35-15：55

End-to-End Automation Integration and Practical Deployment of Automotive Electronics Production Lines

HollySys

15：55-16：00

Closing Remarks